IBM to build 1000 times faster PCs

Get ready for next-generation computers and smartphones that are up to 1,000 times faster than the systems you use today. Computer maker IBM is developing "skyscraper" computers using huge sandwiches of silicon chips by sticking layer after layer of chips covered with tiny components together.

The process, for which IBM has roped in glue maker 3M, will make PCs and smartphones up to 1,000 times faster than the existing ones and are expected to be available in market by 2013.

The 3M currently makes heat resistant glues, adhesives used in the aerospace industry and sticky tapes, but the hi-tech glues created for IBM could actually be the key step towards making the next evolutionary leap in computing, the Daily Mail reported